SFM5 Smart Flip Chip Machine
(In stock)
| Product Name | SFM5 Smart Flip Chip Machine |
| Model Number | SFM5 |
| Brand | Hanwha Precision Machinery (now Hanwha Semitech) |
| Category | Flip Chip Bonder – Semiconductor Back-End Packaging Equipment |
| Country of Origin | South Korea |
| Material | Precision-engineered semiconductor-grade hardware; multi-head (8-head) automatic bonding system with high-precision motion components and advanced thermal control systems. |
| Applications | High-speed, ultra-precise placement of flip-chip dies onto wafers in semiconductor packaging, suitable for integration into advanced packaging lines used by IDMs and OSATs. |
The SFM5 is Hanwha Semitech’s next-generation, high-speed flip chip bonder featuring an 8-head configuration (2 gantries × 4 heads). It achieves rapid production at up to 15,000 units per hour (UPH) with ±5 µm accuracy, delivering high‑throughput and precision for semiconductor back-end packaging applications. It’s engineered to meet demands of global IDM and OSAT production lines
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