New BSL CMP Pad Conditioner
(In stock)
| Product Name | New BSL CMP Pad Conditioner |
| Model Number | BSL-CMP (variant sizes, e.g. 108SBN / 108SBS etc.) |
| Brand | EHWA Diamond |
| Category | CMP (Chemical Mechanical Polishing) Consumable / Pad Conditioner |
| Country Origin | South Korea |
| Material | Diamond-holding method: Uses proprietary brazing with controlled diamond orientation to give strong holding force (both chemical reaction + mechanical contact). Interface / Bond: Carbide (or similar high hardness interface) between diamond and substrate; corrosion resistant bonding .Design features: “Chip pockets” to give circulation of slurry and swarf (to avoid clogging), better pad cut rate (PCR), improved surface roughness after conditioning |
| Applications | For conditioning CMP pads in silicon wafer polishing / semiconductor CMP process. Helps maintain consistent pad surface roughness, improves pad cut rate, reduces pad glazing / degradation. |
· Strong diamond holding force : Chemical reaction + Mechanical contact
· Corrosion resistance : Carbide interface between diamond & bond material
· Longer lifetime : Utilization of edges by diamond face
· Maximized diamond chip pocket by high diamond exposure
→ Excellent conditioning efficiency and pad debris removal rate
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