AMEBA 3D MA Series
(In stock)
| Product Name | AMEBA 3D MA Series |
| Model Number | MA-Series (e.g. “AMEBA 3D MA”) |
| Brand | AMEBA 3D (AnyCasting Co., Ltd.) |
| Category | Automated 3D Print / Circuit Additive Manufacturing Equipment |
| Country Origin | South Korea |
| Material | Conductive metals / bonding materials (e.g. Ag, Au, Cu, etc.) via S-ECAM (Selective ElectroChemical Additive Manufacturing) process. |
| Applications | High‐volume 3D circuit production lines — wafer bumps, conductive paths, bonding layers, embedded circuits in electronics / semiconductors. |
The AMEBA 3D MA Series is positioned as the automated mass production model in AMEBA’s 3D circuit printing roadmap. It builds upon the M Series by integrating advanced systems such as Active Alignment and robotic automation (M2M / Industry 4.0) to enable seamless production line integration.
As per AMEBA’s roadmap, the MA Series is designed to be optimized and customized for high-volume manufacturing environments.
It supports the same S-ECAM (Selective ElectroChemical Additive Manufacturing) methodology used for 3D circuit printing: depositing metal in ionic form along optimized paths derived from 3D CAD input.
The MA Series is intended for demanding use cases such as wafer bump production (3-300 µm diameter, 10-500 µm height) and high-power semiconductor bonding (Ag deposition, direct circuits on DBC / ceramic substrates).
ameba3d.com
Its automation features (alignment, robotics) help reduce manual intervention, improve throughput, and maintain precision in large production volumes.
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