The AMEBA 3D S Series, leveraging S-ECAM (Selective ElectroChemical Additive Manufacturing), enables the direct 3D printing of complex electronic circuits with high precision and freedom. It supports line widths from 1 µm to 5,000 µm, and line thicknesses from 1 µm to 1,000 µm, enabling high aspect ratios (≥ 1:5) and fine line/space resolutions (e.g. 20 µm or less) 

Because the process prints in the state of metal ions, the resulting conductivity approaches that of the pure metal (e.g., for copper, ~5.96 × 10⁷ S/m) 

 Multiple metals are printable, including Cu, Ni, Ag, Au, Pt, Sn, etc. 

Compared with subtractive or etching-based methods (e.g. wet etching or plating), S-ECAM significantly reduces processing steps, eliminates many masking steps, and cuts cost and time. The total processing amount and time are “less than half” compared to conventional multi-step processes. 

The S Series is well-suited for applications such as wafer bumping, multi-layer circuits, bond layers in high-power modules, where 3D thickness control and structural freedom are needed. Because AMEBA can print diverse thicknesses and patterns, it offers design flexibility beyond conventional planar processes.