AMEBA 3D M Series (Mass Production / Customized Model)
(In stock)
| Product Name | AMEBA 3D M Series (Mass Production / Customized Model) |
| Model Number | M / MA Series (e.g. “AMEBA 3D M” / “AMEBA 3D MA”) |
| Brand | AMEBA 3D (AnyCasting Co., Ltd.) |
| Category | Additive Manufacturing / 3D Circuit Printing Equipment |
| Country Origin | South Korea |
| Material | Conductive metals (e.g. silver (Ag), gold (Au), or other bonding / circuit metals) via S-ECAM (Selective ElectroChemical Additive Manufacturing) process . |
| Applications | Mass production of 3D circuits, wafer bumps, conductive paths, bonding layers in high-power electronics, semiconductors, automotive, ICT, defense sectors. |
The AMEBA 3D M Series is a mass production version of the AMEBA 3D circuit printing platform, designed for high-volume industrial deployment. In their product roadmap, AMEBA 3D describes this M Series as the Customized & Mass Production Model suited for integration into production lines.
ameba3d.com
It bridges the gap between prototyping and full-scale manufacturing. The M Series aims to offer higher throughput, reliability, and automation compared to the S Series (which is targeted at prototyping and R&D).
ameba3d.com
In addition, the MA Series is projected to be a further-automated mass production system combining Active Alignment, robotics, and Industry 4.0 automation (M2M connectivity) for fully integrated manufacturing lines.
ameba3d.com
The M / MA models enable printing of features such as wafer bumps with diameters between 3 µm and 300 µm and heights between 10 µm and 500 µm, supporting aspect ratios up to 1:5.
ameba3d.com
They also support high-temperature bonding materials (e.g. Ag) and printing directly onto substrates like ceramics (for high-power semiconductors) or circuit boards (e.g. DBC).
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