CVD CMP Pad Conditioner
(In stock)
| Product Name | CVD CMP Pad Conditioner |
| Model Number | CVD CMP Pad Conditioner” under EHWA’s portfolio |
| Brand | EHWA Diamond |
| Category | CMP (Chemical Mechanical Polishing) Pad Conditioner / Semiconductor Manufacturing Consumable |
| Country Origin | South Korea |
| Material | Substrate base material (typically metal) plated or coated with CVD (Chemical Vapor Deposition) diamond tips. Diamond-coated tips arranged in various patterns; apex of each diamond tip has a flat face to ensure stable and uniform contact with CMP pad. |
| Applications | Used to condition CMP pads in semiconductor wafer polishing. That is, refresh / maintain pad surface (micro-texture), ensure consistent material removal rates (MRR), reduce defectivity. Helps avoid shedding of diamond chips (common issue in conventional pad conditioners like electroplated or brazed tips). Enables better stability and reproducibility in CMP process performance. |
· Various patterns can be arranged CVD diamond coated tips
· Apex of the CVD diamond coated tip is flat face
· Allows to engineer the critical pressure applied to each tip for pad conditioning
· EHWA has a patents on the tip size and number for pad conditioning
· The apex where contacts the pad has not changed over the conditioning time
· Pad cut rate is constant
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