μMiC (Micro‑Module in Chip)
(In stock)
| Product Name | μMiC (Micro‑Module in Chip) |
| Model Number | Multiple embedded IC modules (e.g., CA‑IF1044Ax‑Q1, CA‑IS3062x, CA‑IS2062x, CA‑IS23xxxS) |
| Brand | Chipanalog (Shanghai Chipanalog Microelectronics Co., Ltd.) |
| Category | Embedded micro‑modules, integrating isolation, interface, power, and smart switches |
| Country of Origin | China (Shanghai) |
| Material | Construction: Silicon CMOS/BCD ICs with integrated passive components and advanced packaging (SOIC, DFN, etc.) for compact system-level modules. |
| Applications | Ideal for system-in-package (SiP) memory integration in:/ Industrial controllers, smart meters, IoT endpoints Solid-state data logging and enterprise storage/ Automotive ECUs, medical electronics, mission-critical systems, gaming devices. |
μMiC is a series of Chipanalog micro-module in chip products. These featured products integrate high-performance IC design, advanced packaging technologies and system level integration within a single module, offer a complete system-level solution for the end customers. Our μMiC@ technology is committed to providing differentiated design and helping customer dramatically reduce system design complexity, size and total cost. Also, high integration simplifies the components supply-chain and ensures the safety of the supply chain.
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