Diamond Wire - Squaring
(In stock)
| Product Name | Diamond Wire - Squaring |
| Model Number | - |
| Brand | EHWA Diamond |
| Category | Diamond Wire / Wire Saw Cutting Tools - Squaring / Silicon Wafer / Thin Slicing Processes. |
| Country Origin | South Korea |
| Material | High tensile wire core + uniformly distributed industrial diamond grit; high diamond retention; designed for minimal wire breakage. |
| Applications | Used in squaring / slicing silicon wafers or similar thin wafer slicing applications; intended for precision squared cuts, where clean, accurate slicing without chipping or wire breakage is crucial. Suitable for semiconductor, solar cell manufacture, LED industries etc., where ultra-thin slicing and high uniformity matter. |
· High throughput & Superior cutting quality
– Reduced process lead time and kerf loss
– Enhanced flatness of cut materials and superior warp, TTV and Bow values
· Applicable for thin wafer slicing – Through uniform diamond grit
· Longer wire lifetime – Excellent diamond retention & no wire breakage
· Faster cutting speed – 3~10 times compared with slurry process
· Low cost and eco-friendly – Slurry free process
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