SFM3 3rd Generation Smart Flip Chip Machine
(In stock)
| Product Name | SFM3 3rd Generation Smart Flip Chip Machine |
| Model Number | SFM3 |
| Brand | Hanwha Precision Machinery (now Hanwha Semitech) |
| Category | Flip Chip Bonder – Semiconductor Packaging Equipment |
| Country of Origin | South Korea |
| Material | High-precision semiconductor-grade hardware featuring 2 spindles per head and dual gantry configuration, with advanced vision and bonding control system. |
| Applications | Ultra-precise placement of flip-chip dies onto substrates; suited for high-accuracy semiconductor packaging line applications. |
The SFM3 is Hanwha Semitech’s 3rd‑generation smart flip chip machine, engineered for superior precision and productivity in semiconductor back-end packaging. Featuring dual–gantry architecture with 2 spindles per head (4 heads total), it reaches optimal throughput of approximately 7,000–7,800 UPH and achieves high placement accuracy of ±5 μm @ 3σ. It supports a wide range of die sizes (0.5 mm to 32 mm square), die thicknesses (≥0.04 mm), wafer frame sizes up to 12", and substrate sizes up to 330 mm—ideal for IDMs and OSATs striving for micro-level precision and stable die-bonding performance.
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